WED · SEP 09 2026 AIXX GLOBAL AI COMPUTE NEWS · VERIFIED EXCHANGE MEMBERSHIP

CHIPS

GPUs, AI silicon, process nodes, packaging and supply — first-hand intel from the chips desk of the verified compute exchange.

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RUBIN CHIPS

NVIDIA's next-gen Rubin platform ramps early as TSMC 3nm books out through 2027

18.2K views
SUPPLY CHAIN

SK hynix HBM4 yields beat expectations, Q4 volume shipments to NVIDIA

12-hi stack yields top 60%, securing early-2027 supply.

9.1K views CHIPS

TSMC expands CoWoS capacity by another 40%, easing the AI packaging bottleneck

Monthly capacity may top 90k wafers by late 2027, with NVIDIA and Broadcom taking most of it.

12.4K views

LATEST IN CHIPS

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TEARDOWN12:40 CHIPS

Teardown: B300's eight HBM3e stacks and the new power board

18.9K views COWOS CHIPS

TSMC expands CoWoS capacity by another 40%, easing the AI packaging bottleneck

12.4K views HBM4 SUPPLY CHAIN

SK hynix HBM4 yields beat expectations, Q4 volume shipments to NVIDIA

9.1K views HBM3E SUPPLY CHAIN

Samsung re-enters NVIDIA's approved vendor list for HBM3e

8.2K views GAUDI 4 CHIPS

Intel's Gaudi 4 lands a major edge-inference deal, targeting 500k units

6.1K views 18A CHIPS

Intel 18A yields on target as next-gen Xeon ramps ahead of plan

3.8K views SiC SUPPLY CHAIN

Wide-bandgap power shortage leaves data center PSU retrofits queued 26 weeks

4.8K views 800G CHIPS

Cisco buys AI networking silicon startup for $24B, heating up the DPU race

4.3K views
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